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Engineering Manager

Company: Micross Components
Location: Manchester
Posted on: September 23, 2022

Job Description:

Micross Components (www.micross.com) is a leading global provider of distributed and specialty electronic components for military, space, medical, and demanding industrial applications. Operating as a single source for high reliability and state-of-the-art electronics, Micross solutions range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 35+ year heritage, Micross possesses the design, manufacturing and logistics expertise needed to support an application from start to finish.Position has overall engineering design and development responsibility for Micross- Manchester (NH) component modification services; works closely with the leadership team to develop strategy, lead continuous improvement efforts, and manage performance standards in building a best-in-class industry operation.Essential Duties and Responsibilities Provide strategic development, guidance, direction and oversight to an engineering team to plan and coordinate daily activities, and meet performance expectations. Direct, plan, and implement policies and objectives to increase operations productivity and maximize return on investments. Provide mentorship and coaching to enhance individual and organizational technical knowledge and capabilities. Develop and/or expand manufacturing processes and services to help the company scale and improve the overall value of the business. Meet or exceed company goals and cost objectives through management and oversight of engineering development and sustaining activities. Exceptional judgment and decision-making skills. Self-directed with the ability to lead, take charge, and offer opinions and direction. Good listener with the ability to communicate information, ideas, and feedback verbally and in writing so others clearly understand. Support a work environment of continuous improvement, where the fundamentals of lean manufacturing and process control are actively practiced with measurable results and sustain a culture of continue improvement through team member participation. Conceive, direct, plan, and implement new equipment and solder finishing processes to increase automation, productivity, and maximize return on capital investments. Establish manufacturing / processing design standards ensure compliance. Create, design, & source process equipment tooling, dies, & component handling devices. Design, organize, and source robotic equipment tooling such as grippers, manifolds, & hand tools. Apply broad experience with manufacturing processes and controls; Demonstrate ability to architect and manage new process development / qualification activities. Research equipment, supplies, & technologies to evaluate best-in-class processing solutions; Research emergent semiconductor process technologies and impart into business. Coordinate w/ Sales, Quality, Engineering, & Production to comprehend customer make-to-order quote requests & determine ability to comply w/ customer specifications; Resolve conflicts between customer requirements and company capabilities to ensure alignment with capabilities to RFQs. Provide applications support to customers; facilitate audits and technical exchanges with customers. Conduct product validations on custom make-to-order requirements. Investigate new vendors for outsourcing applications & quality and reliability testing. Ability to draft engineering white papers, authoritative, in-depth report(s) on industry related topics which can be utilized to advance and promote company IP / design methodologies. Participate in industry working seminars and help define industry regulations and standards. Works with integrity and ethical business practices. Security Clearance is a plus.Due to export control rules, must be a US personEducation / Work Experience Desired: B.S. degree materials science (e.g. metallurgy), and/or related chemistry / mechanical degree Knowledge of SnPb & SAC305 solders, robotic hot solder dip processes +10 years of experience in related semiconductor assembly and/or PCB assembly operations with demonstrated successive levels of managerial growth. Intimate knowledge of semiconductor packaging technologies Working knowledge of GEIA-STD-0006, MIL-STD-883, AS9100, ISO quality standards Demonstrated working knowledge and use of quality tools: DOE, PFMEA, SPC, etc Working knowledge of Solidworks and/or related engineering 3D design / CAD tools Established written and verbal communications skills Senior management level experience in a low volume/high mix build to print or contract manufacturing environment Managing growth in a technical environment, preferably from within the defense and aerospace industries Demonstrated ability to develop constructive, long-term customer and supplier relationships

Keywords: Micross Components, Manchester , Engineering Manager, Executive , Manchester, New Hampshire

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