Senior/Principal Packaging Engineer

Company: Allegro MicroSystems, LLC
Location: Manchester
Posted on: May 28, 2023

Job Description:

Senior/Principal Packaging Engineer page is loaded Senior/Principal Packaging Engineer Apply locations Manchester, NH Richardson, TX time type Full time posted on Posted Yesterday job requisition id R3978 At Allegro we flex. - Flex@Allegro -is our approach to hybrid working that empowers managers and their team members to decide where and when work will be done. Ask what - Flex@Allegro -can mean for you. The Senior/Principal Packaging Engineer will be responsible for the development of advanced IC packaging solutions for various Allegro Product Lines including magnetic speed & position & current sensors and power control, full lifecycle from concept definition, through design & development, qualification and release to high volume production with both internal manufacturing and in partnership with assembly subcontractors. This will include:

• Collaboration with cross functional teams including Business Units, Device Design, Manufacturing (internal and sub-contract), Quality and Reliability
• Design using AutoCAD drawings and 3D models
• Modelling & Simulation
• Package materials and assembly process characterization
• Support qualification and transition of new package to mass production.
• Project schedule and deliverable management to defined targets.
• Documentation/Reporting per internal procedures and regulatory body requirements. Qualifications: The successful candidate will possess a BS or MS in Electrical or Mechanical Engineering or Materials Science with 10+ years of experience in semiconductor packaging design, development and operations/manufacturing. Skills should include:
  • Proficient in the use of AutoCAD, familiarity with GD&T standards.
  • Proficient in the use of 3D design software such as Autodesk Inventor, SolidWorks, Pro-E, etc.
  • Proficient in the use of simulation software such as ANSYS, SolidWorks & Autodesk Simulation.
  • In depth knowledge of packaging materials properties including as epoxies, molding compounds, wires, solders, leadframe alloys etc.
  • In depth knowledge of packaging assembly processes including wafer back-grinding, dicing, wafer bumping, die attach, flip chip, gold and copper wire bonding, transfer and injection molding, MCM, surface mount, plating, singulation, etc.
  • Experience defining and executing process DOEs to optimize package design and processes to mitigate risks.
  • Strong oral and written communication skills, self-driven, results oriented individual with critical and innovative thinking, able to manage key package development projects meeting all milestones. Desired knowledge and experience:
    • Familiarity with package design rules.
    • Familiarity with project management and APQP processes
    • Knowledge of DFMEA/PFMEA.
    • Familiarity with industry Qualification standards including JEDEC, AEC-Q100, IPC, etc.
    • Knowledge on statistical process control (SPC)
    • Six Sigma training is a plus. #LI-MR1 At Allegro, we are committed to providing a harassment-free environment of mutual respect to fuel innovation through inclusive thought collaboration. Allegro is an Equal Opportunity Employer and -does not discriminate on the basis of race, religion, color, sex, gender identity, sexual orientation, age, physical or mental disability, national origin, veteran status, parental status, or any other basis covered by appropriate law. Allegro makes hiring decisions based solely on qualifications, merit, and business needs at the time. About Us Allegro MicroSystems (NASDAQ: ALGM) is a global semiconductor leader in sensor and power integrated circuits (ICs) and photonics. Our team is passionate about developing intelligent solutions that move the world toward a safer and more sustainable future.Allegro products are at the heart of functions that sense, regulate, and drive mechanical systems. Our products are in your car's engine and safety systems, in hyperscale data centers and in the automation enabling efficient factories. If you drive a car, if you use cloud data services, if you receive a package delivery, you're interacting with our technology.We're not just focused on the present-we're looking toward the future. Our semiconductor solutions enable increased driving range for electric vehicles, smaller and more reliable power conversion systems, improved safety and efficiency for motor and power management systems, and safer autonomous driving solutions.Allegro holds over 1,000 global patents and we're constantly innovating to meet the needs of today and tomorrow. That's how we've become the world leader in magnetic sensors* and made Allegro a trusted partner for companies around the world.Headquartered in Manchester, NH (USA) Allegro has a diverse team of 3,500+ employees spread across 13 countries, powering global engineering, manufacturing, and support teams to enable an innovative culture. Our team works hard to create a collaborative, energetic environment that rewards ingenuity and helps employees make a difference every day. We can't wait for you to join us!Allegro is IATF16949:2016 and ISO14001:2015 certified and has received quality awards from leading manufacturers worldwide.*Source: Omdia, MEMS & Sensors Competitive Analysis Database - H1 2020-September 2020.

Keywords: Allegro MicroSystems, LLC, Manchester , Senior/Principal Packaging Engineer, Engineering , Manchester, New Hampshire